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Showing results: 526 - 539 of 539 items found.

  • cDAQ-9137, 1.91 GHz Quad-Core Atom, 8-Slot, CompactDAQ Controller

    784240-01 - NI

    1.91 GHz Quad-Core Atom, 8-Slot, CompactDAQ Controller - The cDAQ‑9137 controls the timing, synchronization, and data transfer between C Series I/O modules and an integrated computer. It includes Intel Atom quad-core processing and 32 GB nonvolatile storage for data-logging and embedded monitoring. You can choose between running Windows or NI Linux® Real‑Time. The cDAQ‑9137 offers a wide array of standard connectivity and expansion options, including SD storage, USB, Ethernet, RS232 serial, and trigger input, and an integrated NI‑XNET port. You can combine the cDAQ‑9137 with up to eight C Series I/O modules for a custom analog I/O, digital I/O, counter/timer, and controller area network (CAN) measurement and logging system. The registered trademark Linux® is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a worldwide basis.

  • cDAQ-9136, 1.91 GHz Quad-Core Atom, 4-Slot, CompactDAQ Controller

    784239-01 - NI

    1.91 GHz Quad-Core Atom, 4-Slot, CompactDAQ Controller - The cDAQ‑9136 controls the timing, synchronization, and data transfer between C Series I/O modules and an integrated computer. It includes Intel Atom quad-core processing and 32 GB nonvolatile storage for data-logging and embedded monitoring. You can choose between running Windows or NI Linux® Real‑Time. The cDAQ‑9136 offers a wide array of standard connectivity and expansion options, including SD storage, USB, Ethernet, RS232 serial, and trigger input, and an integrated NI‑XNET port. You can combine the cDAQ‑9136 with up to four C Series I/O modules for a custom analog I/O, digital I/O, counter/timer, and controller area network (CAN) measurement and logging system. The registered trademark Linux® is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a worldwide basis.

  • cDAQ-9136, 1.91 GHz Quad-Core Atom, 4-Slot, CompactDAQ Controller

    784238-01 - NI

    1.91 GHz Quad-Core Atom, 4-Slot, CompactDAQ Controller - The cDAQ‑9136 controls the timing, synchronization, and data transfer between C Series I/O modules and an integrated computer. It includes Intel Atom quad-core processing and 32 GB nonvolatile storage for data-logging and embedded monitoring. You can choose between running Windows or NI Linux® Real‑Time. The cDAQ‑9136 offers a wide array of standard connectivity and expansion options, including SD storage, USB, Ethernet, RS232 serial, and trigger input, and an integrated NI‑XNET port. You can combine the cDAQ‑9136 with up to four C Series I/O modules for a custom analog I/O, digital I/O, counter/timer, and controller area network (CAN) measurement and logging system. The registered trademark Linux® is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a worldwide basis.

  • cDAQ-9134, 1.33 GHz Dual-Core Atom, 4-Slot, Extended Temperature CompactDAQ Controller

    783341-01 - NI

    1.33 GHz Dual-Core Atom, 4-Slot, Extended Temperature CompactDAQ Controller - The cDAQ‑9134 controls the timing, synchronization, and data transfer between C Series I/O modules and an integrated computer. It includes Intel Atom dual-core processing and 32 GB nonvolatile storage for data-logging and embedded monitoring in extreme environments. You can choose between running Windows or NI Linux® Real‑Time. The cDAQ‑9134 offers a wide array of standard connectivity and expansion options, including SD storage, USB, Ethernet, RS232 serial, and trigger input, and an integrated NI‑XNET port. You can combine the cDAQ‑9134 with up to four C Series I/O modules for a custom analog I/O, digital I/O, counter/timer, and controller area network (CAN) measurement and logging system. The registered trademark Linux® is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a worldwide basis.

  • cDAQ-9134, 1.33 GHz Dual-Core Atom, 4-Slot, Extended Temperature CompactDAQ Controller

    783340-01 - NI

    1.33 GHz Dual-Core Atom, 4-Slot, Extended Temperature CompactDAQ Controller - The cDAQ‑9134 controls the timing, synchronization, and data transfer between C Series I/O modules and an integrated computer. It includes Intel Atom dual-core processing and 32 GB nonvolatile storage for data-logging and embedded monitoring in extreme environments. You can choose between running Windows or NI Linux® Real‑Time. The cDAQ‑9134 offers a wide array of standard connectivity and expansion options, including SD storage, USB, Ethernet, RS232 serial, and trigger input, and an integrated NI‑XNET port. You can combine the cDAQ‑9134 with up to four C Series I/O modules for a custom analog I/O, digital I/O, counter/timer, and controller area network (CAN) measurement and logging system. The registered trademark Linux® is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a worldwide basis.

  • Display Color Analyzer

    Model 7123 - Chroma ATE Inc.

    Luminance and chromaticity measurement of Color Display0.005 cd/m2low luminance measurement (A712301)Wide luminance range: 0.0001 to 25,000 cd/m2 (A712301) 0.01 to 200,000 cd/m2 (A712302)High accuracy measurementMaximum 9 display modes: xyY, TΔuvY, u’ v’ Y, RGB, XYZ, Contrast, ProgramAble to control Video Pattern Generator and UUT (Unit Under Test)Built-in contrast measurement function to calculate the contrast ratio directlyEquipped with programmable test items that can complete the planned tests with one single buttonSupport USB flash disk that can copy the test procedures to other station for useJudgment function embedded to judge the test result automatically with one single buttonCalibration period setting and reminding functionMemory for storing 100 channels of standard color data and calibration dataBuilt-in flat display calibration data LCD-D65 & LED-D65* to be applied for chromaticity measurement instantlyOptional display white balance alignment system can be used to integrate all optical test stations to one single station

  • Build to Print

    ARC Technology Solutions

    In today’s fast paced manufacturing environment, where time to market and cost competitiveness is key, having a manufacturing partner like ARC can be a valuable resource for your company. ARC has a build-to-print manufacturing capability with our unique ‘engineer-to-print’ philosophy to make sure precision manufacturing and final build accuracy is top priority for your module level or system level builds. ARC can support up to several hundred module level assemblies (CCA subassemblies, cabling, mechanical and paneling elements) with abilities to perform a variety of software, embedded tasks and functional testing including a mixed signal test capability using our in-house MSAT (Mixed Signal Automated Tester) platform. We have a thorough process created through the development of our own products and test solutions. We know the importance of having a regimented manufacturing process, augmented with engineering expertise to address challenges that come up with building complex, high-mix, medium volume products.

  • ARINC825 Cards

    AIM GmbH

    AIM’s ARINC825 cards can work either with full functionality as an active CAN node for testing and simulating or in listening only mode for monitoring and recording purposes of Avionic CAN bus (ARINC825) applications on up to 4 electrically isolated CAN bus nodes concurrently. All nodes are in conformance with the ISO11898-1/-2 standard. They are accessible by software separately and can be used as 4 independent CAN bus nodes. An onboard IRIG-B time decoder allows users to accurately synchronize single or multiple modules to a common time source. All supported signals are available through front I/O and rear I/O interface. ARINC825 cards consist of FPGA based CAN interface controllers as well as a FPGA based 32-bit microcontroller core and a separate processor for IRIG-B synchronization with high resolution time stamping. All nodes are operating concurrently at CAN bus high speed bit rate of up to 1Mbit/s with the intelligence to process scheduling of CAN frames in real time onboard to significantly off-load the host processor.For embedded applications the AMC825-4 PMC module is available in a conduction cooled version. Using AIM’s family of PCI, CPCI (3U and 6U) and VMEbus carrier cards for PMC our clients have off the shelf solutions in a broad range of card formats. ARINC825 (CAN bus) modules are delivered with an Application Programming Interface (API) and Driver Software compatible with Windows, Linux and VxWorks.An ARINC825 Resource Component is available for AIM’s PBA.pro™ databus test and analysis tool including Tx and Rx simulation capabilities, a Chronological Bus Monitor and support for decoding of payload data within CAN messages. This allows to implement a powerful ARINC825 (CAN bus) analyzer or a complete test system in conjunction with other AIM avionics databus interfaces and PBA.pro™ supported 3rd party hardware.

  • SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9

    LEC-iMX6R2 - ADLINK Technology Inc.

    The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

  • Pico-ITX SBC With Intel® Pentium® Processor N4200/Celeron® Processor N3350, DisplayPort, LVDS, 2 GbE LAN And Audio

    PICO318 - Axiomtek Co., Ltd.

    The PICO318 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350. The PICO318 is a low power-consumption 2.5-inch embedded board that is expandable, rugged design, feature-rich and versatile to help facilitate quick deployment. The PICO318 is equipped with one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. A dual-display capability is available through 18/24-bit single/dual channel LVDS and DisplayPort. For storage, there are one M.2 key B slot for SATA or PCIe x2 SSD card and one half-size PCI Express Mini Card slot with support for mSATA. Moreover, the pico-ITX form factor single board computer features 12V DC power supply input with AT Auto Power On function. The Intel® Apollo Lake-based pico-ITX board provides rich I/O connectivity including two USB 3.0 ports, two USB 2.0 ports, one RS-232/422/485 port, one RS-232 port, two Gigabit LAN ports with Intel® i211AT Ethernet controller, one HD Codec audio, and 4-channel digital I/O. The PICO318 is suitable for various industrial environments with an operating temperature range of -20°C to +60°C.

  • Software

    B&W Tek, Inc.

    We offer a full suite of software for spectroscopic data collection and analysis designed for users at all levels, and varying applications. Our standard BWSpec® spectral data acquisition software allows for easy collection of data from our Raman systems and modular spectrometers. It includes tools for instrument control for data collection and spectral manipulation. The raw data and corrected data are stored and can be easily viewed. Data manipulation tools include smoothing, baseline correction and derivatives. Data can be saved in different formats for use in additional application software. For spectral identification against Raman spectral libraries with a simple interface for immediate identification for verification with a pass/fail result, our BWID® software provides qualitative analysis. Users of BWID software can create their own Raman spectral libraries, or select from our numerous ready to use libraries. For identification with portable Raman in regulated environments, the US FDA 21 CFR part 11- complaint version of BWID can be used. B&W Tek’s unique see-through identification using the STRam® can also be done using the BWID software operating on the embedded tablet computer of the STRam system. For quantitative analysis, data collected with BWSpec or other packages can be imported into the BWIQ® multivariate data analysis software, offering a full suite of data preprocessing, regression and classification analysis algorithms. PLS regression models from the BWIQ software an be used in rel-time in our BWAnalyst software, for use with the QTRam , as well as in Metrohm’s Vision® software. The i-Raman series portable Raman instruments can also be operated for single acquisition, or for real-time analysis in the Routine Analysis mode of the Vision software.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6314 - Advantech Co. Ltd.

    The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.

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